Bondexpo
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Date : 13-Sep-2010 to 16-Sep-2010
Location : Stuttgart New Exhibition Centre,Stuttgart

Bondexpo is an International Trade Fair for Industrial Bonding Technology, The complete technology for bonding and joining parts. Bonding involves a lot more than simply connecting different materials with diverse surface structures. Adhesives seal and insulate, serve as joint sealing compounds and turn a variety of materials into highly-resistant composite materials.


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